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Performance Analysis of Mixed Carbon Nano Tubes as VLSI Interconnects


  • Electronics and Communication Department, Thapar University, Patiala – 147004, Punjab, India


Background/Objectives: This paper presents various possible structures of Mixed Carbon Nano Tubes bundle which consists of different topology of Single Wall Carbon Nano Tubes (SWCNTs) and Multi wall Carbon Nano Tubes (MWCNTs). Methods/Statistical Analysis: It is assumed in this paper that SWCNTs and MWCNTs are densely packed. An equivalent single conductor model is derived for all the bundles of Mixed CNT. Findings: Performance is analyzed by considering parameters like Propagation delay, Power dissipation and Crosstalk delay of the interconnects having different lengths. Applications: Carbon Nanotubes finds applications in many fields such as biomedical applications, air and water filtration, structural applications etc.


Crosstalk, Equivalent Single Conductor (ESC), Mixed Carbon Nano Tubes (MCB), Power Dissipation.

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  • Rai M, Sarkar S. Carbon Nanotube as a VLSI Interconnect. Electronic Properties of Carbon Nanotube Interconnect. I Edition. 2011; p. 475-94. PMid:21947610
  • Das PK, Majumder MK, Kaushik BK, Dasgupta S. Analysis of propagation delay in mixed carbon nanotube bundle as global VLSI interconnects. Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics. 2012; p. 118-21. Crossref PMCid:PMC3700143
  • Rai MK, Sarkar S. Temperature dependant crosstalk analysis in coupled single‐walled carbon nanotube (SWCNT) bundle interconnects. International Journal of Circuit Theory and Applications. 2015 Oct; 43(10):1367-78. Crossref.
  • Li H, Yin WY, Banerjee K, Mao JF. Circuit modeling and performance analysis of multi-walled carbon nanotube interconnects. IEEE Transactions on Electron Devices. 2008 Jun; 55(6):1328-37. Crossref.
  • Majumder MK, Kaushik BK, Manhas SK. Analysis of delay and dynamic crosstalk in bundled carbon nanotube interconnects. IEEE Transactions on Electromagnetic Compatibility. 2014; 56(6):1666-73. Crossref.
  • Tang KT, Friedman EG. Peak crosstalk noise estimation in CMOS VLSI circuits. Proceedings of ICECS’99, the 6th IEEE International Conference on Electronics, Circuits and Systems.1999; 3:1539-42. Crossref.
  • Davis JA, Meindl JD. Compact distributed RLC interconnect models. I. Single line transient time delay and overshoot expressions. IEEE Transactions on Electron Devices. 2000 Nov; 47(11):2068-77. Crossref Crossref.
  • Sakurai T. Closed-form expressions for interconnection delay coupling and crosstalk in VLSIs. IEEE Transactions on Electron Devices. 1993 Jan; 40(1):118-24. Crossref.


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