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Power Electronics Component Location and Heat Sink Length Optimization – Hybrid Electrical Vehicle (HEV)
Background/Objectives: Main components of Electric Vehicle (EV) inverter such as Insulated Gate Bipolar Transistors (IGBTs) and diodes are subtle to temperature and must operate below fixed temperature limits to function effectively. Currently there are high demands in reducing the size of the inverter to fit in limited space available in vehicles and also to increase the output. Methods/Statistical Analysis: This paper focuses on optimizing best location of PE components with heatsink and optimizing the length of heatsink in order to reduce the overall temperature of a Hybrid Electrical Vehicle (HEV) inverter. The heat transfer model of IGBTs and diodes was modelled in MATLAB environment. The model was enhanced to incorporate heat sink model which was developed based on commercially available heatsink. Simulated annealing optimization method was used for both the optimization. Findings: Applying component location and heatsink length optimization, initial maximum temperature of inverter is reduced from 131.616 to126.979°C. Further, total heat sink length was also reduced from 48cm to 32.1cm. The results obtained clearly indicate that this method is successful as it is able to reduce the overall temperature by 5°C. It is indeed a new finding as current research on heat sink only focuses on finding better heatsink material, interface material, better coolant type and fin optimization. Application/ Improvements: Applying these optimizations in designing stage of an inverter can manage overall heat distribution in an inverter and shrink the packaging size which will lead to cost reduction in manufacturing.
Hybrid Electrical Vehicle (HEV), Heat Sink Length Optimization, Inverter, MATLAB, Power Electronic, Placement Optimization.
- O'Keefe M, Bennion K. A Comparison of Hybrid Electric Vehicle Power Electronics Cooling Options. IEEE Vehicle Power and Propulsion Conference. 2007.
- Whaling C. Electric Drive Power Electronics: An Overview. Article in IEEE Transportation and Electrification, 2014.
- Langer G, Leitgeb M, Nicolics J, Unger M, Hoschopf H, Wenzl FP. Advanced Thermal Management Solutions on PCBs for High Power Applications. IPC APEX EXPO 2014 Las Vegas, 2014.
- White Paper. Thermal Analysis of Semiconductor System. Freescale Semiconductor Industries, 2008.
- Narumanchi S, Mihalic M, Kelly K. Thermal Interface Material for Power Electronics Applications. IEEE ITHERM 2008 Conference. 2008.
- Kimura T, Saitou R, Kubo K, Nakatsu K, Ishikawa H, Sasaki K. High-power-density Inverter Technology for Hybrid and Electric Vehicle Applications. Hitachi Review. 2014; 63.
- Moghaddam AJ, Saedodin S. Entropy generation minimization of pin fin heat sinks by means of metaheuristic methods. Indian Journal of Science and Technology. 2013; 6(7).
- Khan WA, Cullan JR, Yovanovich MM. Optimization of Pin-Fin Heat Sinks Using Entropy Generation Minimization. IEEE Inter Society Conference. 2004.
- Cahlon B, Gertsbakh I, Schochetmanb IE, Shillor M. A model for the convective cooling of electronic components with application to optimal placement. Math Comput Modelling. 1991.
- Steinberg D. Cooling Techniques for Electronic Equipment, Wiley, New York, 1982.
- Wakefield Engineering, High Fin Density Heat SinksFor Power Modules, IGBTs, Relays. High Density Extrusions. 2007.
- Boopalan N, Ramasamy A, Farukh N. Electronic component heat distribution optimization using MATLAB. presented in International Conference on Recent Trends in Computer Science and Electronics (RTCSE). 2016.
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